Waffer Technology Corporation engages in the manufacture and sale of light metal products. The company is involved in the provision of light-metal solution of magnesium and aluminum alloy, mold and tooling research and development, magnesium alloy injection and die-casting, CNC, and painting and assembly of vertical integration OEM/ODM processing services. Its products include cosmetic and internal parts for notebooks; handheld scanners and mobile phone parts; camera, video cam, projector, and monitoring optical parts; and auto parts, as well as other products, such as wearable, tool, and sports products. The company also manufactures and processes automotive aluminum alloy die-cast tools, 3C product magnesium injection tools, and other light metal die-casting tools, as well as fixtures and gauges. It serves medical, industrial, telecommunications, construction, automotive, sporting goods, aeronautical, transportation, national defense, and other industries. The company was formerly known as Waffer Industrial Company, Limited and changed its name to Waffer Technology Corporation in 2000. Waffer Technology Corporation was founded in 1950 and is headquartered in Taoyuan City, Taiwan.
Waffer Technology Dividend Announcement
• Waffer Technology announced a annually dividend of NT$1.68 per ordinary share which will be made payable on . Ex dividend date: 2024-03-28
• Waffer Technology annual dividend for 2024 was NT$1.68
• Waffer Technology annual dividend for 2023 was NT$0.70
• Waffer Technology's trailing twelve-month (TTM) dividend yield is 2.41%
• Waffer Technology's payout ratio for the trailing twelve months (TTM) is 45.87%
Waffer Technology Dividend History
Ex-Div date | Dividend amount | Dividend type | Pay date |
---|---|---|---|
2024-03-28 | NT$1.68 | annually | |
2023-03-24 | NT$0.70 | annually | 2023-04-26 |
2022-04-21 | NT$0.30 | annually | 2022-05-19 |
2021-04-22 | NT$0.60 | annually | 2021-05-21 |
2019-09-19 | NT$0.50 | annually | 2019-10-18 |
2018-09-03 | NT$0.30 | annually | 2018-09-28 |
2017-07-26 | NT$1.99 | annually | 2017-08-22 |
2007-08-03 | NT$0.00 | annually | |
2006-08-04 | NT$0.00 | annually | |
2005-07-28 | NT$0.00 | annually |
Waffer Technology Dividend per year
Waffer Technology Dividend growth
Waffer Technology Dividend Yield
Waffer Technology current trailing twelve-month (TTM) dividend yield is 2.41%. Interested in purchasing Waffer Technology stock? Use our calculator to estimate your expected dividend yield:
Waffer Technology Financial Ratios
Waffer Technology Dividend FAQ
Other factors to consider when evaluating Waffer Technology as a dividend stock include its dividend yield, dividend growth, payout ratio, and the sustainability of its dividend payments given its earnings and cash flow. These factors can provide insight into the company's ability to maintain or increase its dividend in the future.
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1. Determination of Dividend: Waffer Technology's board of directors reviews the company's financial performance, cash flow, future investment needs, and other relevant factors to determine the amount and timing of dividend payments.
2. Dividend Declaration: Once the board approves a dividend, Waffer Technology publicly announces the dividend amount, currency, and the ex-dividend date. The ex-dividend date is the date on or after which the buyer of the stock will not be eligible to receive the upcoming dividend payment.
3. Record Date: The record date is the date on which the company checks its records to identify shareholders who are eligible to receive the dividend. Only shareholders on record as of this date will receive the dividend.
4. Payment Date: On the designated payment date, Waffer Technology distributes the dividend to eligible shareholders. The dividend is usually paid in the form of cash directly into the shareholder's brokerage account or through other designated payment methods.
5. Tax Implications: Dividends received from Waffer Technology are generally taxable as income. Shareholders may need to report dividend income on their tax returns and pay applicable taxes according to their jurisdiction's tax regulations.
1. Record Date: Waffer Technology sets a record date, which is the date on which the company checks its records to determine the eligible shareholders. Only those who are shareholders on record as of this date will receive the dividend.
2. Payment Date: On the designated payment date, Waffer Technology distributes the dividend to eligible shareholders. The payment is usually made electronically, directly into the shareholder's brokerage account or bank account.
3. Currency: Waffer Technology declares the currency in which the dividend will be paid. Depending on the shareholder's location and the currency election made by the shareholder, the dividend will be converted to the appropriate currency during the payment process.
To assess the safety of Waffer Technology's dividend, it is crucial to analyze the company's financial health, debt levels, cash flow generation, and ability to sustain dividend payments over the long term. Additionally, monitoring the company's future earnings, cash flow projections, and management's commitment to dividend policies can provide valuable insights.
It is recommended to review Waffer Technology's financial reports, official announcements, and consult with financial advisors or experts who have access to the most current and comprehensive information about the company's financial situation.