Hua Hong Semiconductor Limited, an investment holding company, manufactures and sells semiconductor products. The company provides embedded non-volatile memory, standard logic and mixed-signal, radio frequency, power management integrated circuits, power discrete, and automotive solutions. It also offers foundry services; and design services comprising standard and customized IP development, full-custom layout design, and customer-specific integrated solutions, as well as design support and tape out services. In addition, the company provides multi-project wafer services; mask making services; and backend services, such as in-house testing, backside processing and dicing, and backend turnkey services, as well as wafer probing, assembly, and testing. Its products are used in consumer electronics, communications, computing, industrial, and automotive markets in the People's Republic of China, North America, Europe, Japan, and other Asian countries. The company was founded in 1997 and is headquartered in Shanghai, the People's Republic of China. Hua Hong Semiconductor Limited is a subsidiary of Shanghai Alliance Investment Ltd.
Hua Hong Semiconductor Dividend Announcement
• Hua Hong Semiconductor announced a annually dividend of HK$0.17 per ordinary share which will be made payable on 2024-06-26. Ex dividend date: 2024-06-03
• Hua Hong Semiconductor annual dividend for 2024 was HK$0.17
• Hua Hong Semiconductor's trailing twelve-month (TTM) dividend yield is 0.78%
• Hua Hong Semiconductor's payout ratio for the trailing twelve months (TTM) is 32.90%
Hua Hong Semiconductor Dividend History
Ex-Div date | Dividend amount | Dividend type | Pay date |
---|---|---|---|
2024-06-03 | HK$0.17 | annually | 2024-06-26 |
2019-05-14 | HK$0.31 | annually | 2019-06-26 |
2018-05-14 | HK$0.31 | annually | 2018-06-14 |
2017-05-16 | HK$0.30 | annually | 2017-06-16 |
2016-05-13 | HK$0.27 | annually | 2016-06-30 |
Hua Hong Semiconductor Dividend per year
Hua Hong Semiconductor Dividend growth
Hua Hong Semiconductor Dividend Yield
Hua Hong Semiconductor current trailing twelve-month (TTM) dividend yield is 0.78%. Interested in purchasing Hua Hong Semiconductor stock? Use our calculator to estimate your expected dividend yield:
Hua Hong Semiconductor Financial Ratios
Hua Hong Semiconductor Dividend FAQ
Other factors to consider when evaluating Hua Hong Semiconductor as a dividend stock include its dividend yield, dividend growth, payout ratio, and the sustainability of its dividend payments given its earnings and cash flow. These factors can provide insight into the company's ability to maintain or increase its dividend in the future.
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1. Determination of Dividend: Hua Hong Semiconductor's board of directors reviews the company's financial performance, cash flow, future investment needs, and other relevant factors to determine the amount and timing of dividend payments.
2. Dividend Declaration: Once the board approves a dividend, Hua Hong Semiconductor publicly announces the dividend amount, currency, and the ex-dividend date. The ex-dividend date is the date on or after which the buyer of the stock will not be eligible to receive the upcoming dividend payment.
3. Record Date: The record date is the date on which the company checks its records to identify shareholders who are eligible to receive the dividend. Only shareholders on record as of this date will receive the dividend.
4. Payment Date: On the designated payment date, Hua Hong Semiconductor distributes the dividend to eligible shareholders. The dividend is usually paid in the form of cash directly into the shareholder's brokerage account or through other designated payment methods.
5. Tax Implications: Dividends received from Hua Hong Semiconductor are generally taxable as income. Shareholders may need to report dividend income on their tax returns and pay applicable taxes according to their jurisdiction's tax regulations.
1. Record Date: Hua Hong Semiconductor sets a record date, which is the date on which the company checks its records to determine the eligible shareholders. Only those who are shareholders on record as of this date will receive the dividend.
2. Payment Date: On the designated payment date, Hua Hong Semiconductor distributes the dividend to eligible shareholders. The payment is usually made electronically, directly into the shareholder's brokerage account or bank account.
3. Currency: Hua Hong Semiconductor declares the currency in which the dividend will be paid. Depending on the shareholder's location and the currency election made by the shareholder, the dividend will be converted to the appropriate currency during the payment process.
To assess the safety of Hua Hong Semiconductor's dividend, it is crucial to analyze the company's financial health, debt levels, cash flow generation, and ability to sustain dividend payments over the long term. Additionally, monitoring the company's future earnings, cash flow projections, and management's commitment to dividend policies can provide valuable insights.
It is recommended to review Hua Hong Semiconductor's financial reports, official announcements, and consult with financial advisors or experts who have access to the most current and comprehensive information about the company's financial situation.