HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers vision placement equipment; flip chip, TSV dual stacking, TC, flip chip, jumbo panel flip chip, and die flip chip bonders; and EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment. It also provides power ECU auto, test handler, vision placement, trim, and form/singulation devices, as well as 3D vision inspection equipment; auto mold, compression auto mold, mechanical mold press, and hydraulic mold press equipment; laser marking, laser wafer marking, laser ablation, laser cutting, and laser cutting/deflash equipment. In addition, the company offers cam press trim and form, micro cam press, CSP singulation, pick and place, die soater, strip mounter, and test equipment. HANMI Semiconductor Co., Ltd. was founded in 1980 and is based in Incheon, South Korea.
HANMI Semiconductor Dividend Announcement
• HANMI Semiconductor announced a annually dividend of ₩420.00 per ordinary share which will be made payable on 2024-03-29. Ex dividend date: 2024-03-06
• HANMI Semiconductor annual dividend for 2024 was ₩420.00
• HANMI Semiconductor annual dividend for 2023 was ₩420.00
• HANMI Semiconductor's trailing twelve-month (TTM) dividend yield is 0.58%
• HANMI Semiconductor's payout ratio for the trailing twelve months (TTM) is 22.32%
• HANMI Semiconductor's dividend growth over the last five years (2018-2023) was 10.93% year
• HANMI Semiconductor's dividend growth over the last ten years (2013-2023) was 0.49% year
HANMI Semiconductor Dividend History
| Ex-Div date | Dividend amount | Dividend type | Pay date |
|---|---|---|---|
| 2024-03-06 | ₩420.00 | annually | 2024-03-29 |
| 2023-03-06 | ₩420.00 | annually | |
| 2022-12-28 | ₩200.00 | annually | 2023-03-31 |
| 2021-12-29 | ₩600.00 | annually | 2022-03-01 |
| 2020-12-29 | ₩400.00 | annually | 2021-03-26 |
| 2019-12-27 | ₩100.00 | annually | 2020-03-19 |
| 2018-12-27 | ₩250.00 | annually | 2019-03-14 |
| 2017-12-27 | ₩240.00 | annually | 2018-03-14 |
| 2016-12-28 | ₩400.00 | annually | |
| 2015-12-29 | ₩400.00 | annually | |
| 2014-12-29 | ₩400.00 | annually | |
| 2013-12-27 | ₩400.00 | annually |
HANMI Semiconductor Dividend per year
HANMI Semiconductor Dividend growth
HANMI Semiconductor Dividend Yield
HANMI Semiconductor current trailing twelve-month (TTM) dividend yield is 0.58%. Interested in purchasing HANMI Semiconductor stock? Use our calculator to estimate your expected dividend yield:
HANMI Semiconductor Financial Ratios
HANMI Semiconductor Dividend FAQ
1. Growth opportunities: Companies, especially in fast-growing industries like technology, reinvest earnings into expansion, R&D, or acquisitions to fuel future growth and increase company value.
2. Tax implications: Not paying dividends can reduce the tax burden on shareholders, who may prefer to defer taxes until selling shares and realizing capital gains.
3. Investor preferences: Some investors prefer companies to reinvest profits for higher long-term returns, particularly those seeking capital appreciation over income.
4. Capital allocation priorities: Companies may allocate cash to pay down debt, fund share buybacks, or invest in projects with higher returns than dividends.
5. Market expectations: In certain sectors, like technology, reinvesting profits for growth and innovation is often prioritized over distributing dividends to shareholders.
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