China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
China Wafer Level CSP Dividend Announcement
• China Wafer Level CSP announced a annually dividend of ¥0.05 per ordinary share which will be made payable on 2024-05-24. Ex dividend date: 2024-05-24
• China Wafer Level CSP annual dividend for 2024 was ¥0.05
• China Wafer Level CSP annual dividend for 2023 was ¥0.07
• China Wafer Level CSP's trailing twelve-month (TTM) dividend yield is 0.17%
• China Wafer Level CSP's payout ratio for the trailing twelve months (TTM) is 35.45%
• China Wafer Level CSP's dividend growth over the last five years (2018-2023) was 1.68% year
China Wafer Level CSP Dividend History
Ex-Div date | Dividend amount | Dividend type | Pay date |
---|---|---|---|
2024-05-24 | ¥0.05 | annually | 2024-05-24 |
2023-07-10 | ¥0.07 | annually | 2023-07-10 |
2022-05-20 | ¥0.28 | annually | 2022-05-20 |
2021-06-15 | ¥0.21 | annually | 2021-06-15 |
2020-05-19 | ¥0.08 | annually | 2020-05-19 |
2019-04-15 | ¥0.05 | annually | 2019-04-15 |
2018-06-21 | ¥0.06 | annually | 2018-06-21 |
2017-05-12 | ¥0.04 | annually | 2017-05-12 |
2016-05-19 | ¥0.08 | annually | |
2015-05-22 | ¥0.14 | annually | |
2014-05-15 | ¥0.11 | annually |
China Wafer Level CSP Dividend per year
China Wafer Level CSP Dividend growth
China Wafer Level CSP Dividend Yield
China Wafer Level CSP current trailing twelve-month (TTM) dividend yield is 0.17%. Interested in purchasing China Wafer Level CSP stock? Use our calculator to estimate your expected dividend yield:
China Wafer Level CSP Financial Ratios
China Wafer Level CSP Dividend FAQ
Other factors to consider when evaluating China Wafer Level CSP as a dividend stock include its dividend yield, dividend growth, payout ratio, and the sustainability of its dividend payments given its earnings and cash flow. These factors can provide insight into the company's ability to maintain or increase its dividend in the future.
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1. Determination of Dividend: China Wafer Level CSP's board of directors reviews the company's financial performance, cash flow, future investment needs, and other relevant factors to determine the amount and timing of dividend payments.
2. Dividend Declaration: Once the board approves a dividend, China Wafer Level CSP publicly announces the dividend amount, currency, and the ex-dividend date. The ex-dividend date is the date on or after which the buyer of the stock will not be eligible to receive the upcoming dividend payment.
3. Record Date: The record date is the date on which the company checks its records to identify shareholders who are eligible to receive the dividend. Only shareholders on record as of this date will receive the dividend.
4. Payment Date: On the designated payment date, China Wafer Level CSP distributes the dividend to eligible shareholders. The dividend is usually paid in the form of cash directly into the shareholder's brokerage account or through other designated payment methods.
5. Tax Implications: Dividends received from China Wafer Level CSP are generally taxable as income. Shareholders may need to report dividend income on their tax returns and pay applicable taxes according to their jurisdiction's tax regulations.
1. Record Date: China Wafer Level CSP sets a record date, which is the date on which the company checks its records to determine the eligible shareholders. Only those who are shareholders on record as of this date will receive the dividend.
2. Payment Date: On the designated payment date, China Wafer Level CSP distributes the dividend to eligible shareholders. The payment is usually made electronically, directly into the shareholder's brokerage account or bank account.
3. Currency: China Wafer Level CSP declares the currency in which the dividend will be paid. Depending on the shareholder's location and the currency election made by the shareholder, the dividend will be converted to the appropriate currency during the payment process.
To assess the safety of China Wafer Level CSP's dividend, it is crucial to analyze the company's financial health, debt levels, cash flow generation, and ability to sustain dividend payments over the long term. Additionally, monitoring the company's future earnings, cash flow projections, and management's commitment to dividend policies can provide valuable insights.
It is recommended to review China Wafer Level CSP's financial reports, official announcements, and consult with financial advisors or experts who have access to the most current and comprehensive information about the company's financial situation.